Head venture capital issues bonds to support technological innovation

On March 3, two leading venture capital companies, Shanghai Science and Technology Venture Capital Group and Zhongguancun Development Group, disclosed their issuance announcements on the Shanghai Stock Exchange, and filed for the issuance of technology innovation bonds totaling 1.5 billion yuan. Shanghai Kechuang Investment Group plans to issue 21 Kechuang K1 (175828.SH) with a term […]

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